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DIESHEARSTRENGTH1.PURPOSE.Thepurposeofthistestistodeterminetheintegrityofmaterialsandproceduresusedtoattachsemiconductordieorsurfacemountedpassiveelementstopackageheadersorothersubstrates.Thisdeterminationisbasedonameasureofforceappliedtothedie,thetypeoffailureresultingfromthisapplicationofforce(iffailureoccurs)andthevisualappearanceoftheresidualdieattachmediaandsubstrate/headermetallization.2.APPARATUS.Thetestequipmentshallconsistofaload-applyinginstrumentwithanaccuracyof5percentoffullscaleor50grams,whicheveristhegreatertolerance.Acirculardynamometerwithaleverarmoralinearmotionforceapplyinginstrumentmaybeusedtoapplytheforcerequiredfortesting.Thetestequipmentshallhavethefollowingcapabilities:a.Adiecontacttoolwhichappliesauniformdistributionoftheforcetoanedgeofthedie(seefigure2019-1).Acompliant(conforming)material(e.g.,nailpolish,tape,etc.)maybeappliedtothefaceofthecontacttooltoensueuniformforcedistributionontheedgeofthedie.b.Provisionstoassurethatthediecontacttoolisperpendiculartothediemountingplaneoftheheaderorsubstrate.c.Arotationalcapability,relativetotheheader/substrateholdingfixtureandthediecontacttool,tofacilitatelinecontactontheedgeofthedie;i.e.,thetoolapplyingtheforcetothedieshallcontactthedieedgefromend-to-end(seefigure2019-2).d.Abinocularmicroscopewithmagnificationcapabilitiesof10Xminimumandlightingwhichfacilitatesvisualobservationofthedieanddiecontacttoolinterfaceduringtesting.3.PROCEDURE.Thetestshallbeconducted,asdefinedherein,ortothetestconditionsspecifiedintheapplicablespecificacquisitiondocumentconsistentwiththeparticularpartconstruction.Alldiestrengthtestsshallbecountedandthespecificsampling,acceptance,andaddedsampleprovisionsshallbeobserved,asapplicable.3.1Shearstrength.Aforcesufficienttoshearthediefromitsmountingorequaltotwicetheminimumspecifiedshearstrength,whicheveroccursfirst,shallbeappliedtothedieusingtheapparatusof2above.NOTE:Forpassiveelementsonlyattachedattheendterminations,theareausedtodeterminetheforceapplieds
